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SMT Hybrid Packaging 2012 - System Integration in Micro Electronics

SMT Hybrid Packaging is Europe´s largest event on System Integration in Micro Electronics. It is the ideal platform for the industry's leading companies to show the latest trends and developments as well as up-to-date solutions. With 32% foreign exhibitors, the event offers not only a wide, but also an international spectrum. Present your solutions to numerous trade visitors!

When May 08, 2012 09:00 to
May 10, 2012 05:00
Where Nuremberg
Contact Name Anthula Parashoudi
Contact Phone +49 711 61946-34
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In 2012, SMT Hybrid Packaging takes place at the same time as PCIM Europe, Europe's leading meeting-point for specialists in Power Electronics and its applications in Intelligent Motion and Power Quality. Visiting PCIM Europe is free of charge for visitors of SMT Hybrid Packaging.

From design and development to PCB production, components, assembly, soldering, packaging and test systems - SMT Hybrid Packaging offers a comprehensive and compact presentation of products and services all under one roof!

The trade visitors of SMT Hybrid Packaging are experts and decision makers mainly from divisions management, development, production, quality control, technical and corporate management, who attend the international meeting point, gathering latest product information for future planned investments.

Exhibition Topics

The SMT Hybrid Packaging shows the complete spectrum on System Integration in Micro Electronics. This international meeting point in the field of electronic manufacturing offers the latest products, services and solutions. From Assembly, PCB, Soldering to Test - the complete market overview under one roof.

  • Assembly
  • Components
  • Design and Development
  • EMS
  • PCB production
  • Packaging
  • Screen Printing
  • Soldering
  • Test Systems
    and many mor

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